ZHCSAK8J December 2003 – June 2022 TPS40054 , TPS40055 , TPS40057
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
MOSFET package selection depends on MOSFET power dissipation and the projected operating conditions. In general, for a surface-mount applications, the DPAK style package provides the lowest thermal impedance (θJA) and, therefore, the highest power dissipation capability. However, the effectiveness of the DPAK depends on proper layout and thermal management. The θJA specified in the MOSFET data sheet refers to a given copper area and thickness. In most cases, a lowest thermal impedance of 40°C/W requires one square inch of 2-ounce copper on a G-10/FR-4 board. Lower thermal impedances can be achieved at the expense of board area. Please refer to the selected MOSFET's data sheet for more information regarding proper mounting.