ZHCSLL3A March 2022 – September 2023 TPS3760-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | TPS3760-Q1 | UNIT | |
|---|---|---|---|
| DYY | |||
| 14-PIN | |||
| RθJA | Junction-to-ambient thermal resistance | 131.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |