ZHCSF71D December 2015 – December 2019 TPS2H160-Q1
PRODUCTION DATA.
| PIN | I/O | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | NO. | |||
| VERSION A | VERSION B | |||
| CL | 7 | 7 | O | Adjustable current limit. Connect to device GND if external current limit is not used. |
| CS | — | 6 | O | Current-sense output |
| DIAG_EN | 3 | 3 | I | Enable-disable pin for diagnostics; internal pulldown |
| FAULT | — | 4 | O | Global fault report with open-drain structure, ORed logic for dual-channel fault conditions |
| GND | 8 | 8 | — | Ground pin |
| IN1 | 1 | 1 | I | Input control for channel 1 activation; internal pulldown |
| IN2 | 2 | 2 | I | Input control for channel 2 activation; internal pulldown |
| NC | 4, 10 | 10 | — | No internal connection |
| ST1 | 5 | — | O | Open-drain diagnostic status output for channel 1 |
| ST2 | 6 | — | O | Open-drain diagnostic status output for channel 2 |
| SEL | — | 5 | I | CS channel-selection bit; internal pulldown |
| THER | 9 | 9 | I | Thermal shutdown behavior control, latch off or auto-retry; internal pulldown |
| OUT1 | 15, 16 | 15, 16 | O | Output of the channel 1 high side-switch, connected to the load |
| OUT2 | 11, 12 | 11, 12 | O | Output of the channel 2 high side-switch, connected to the load |
| VS | 13, 14 | 13, 14 | I | Power supply |
| Thermal pad | — | — | — | Connect to device GND or leave floating |