ZHCSHW5A September 2017 – December 2017 TPS23521
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Selecting RSNS
- 9.2.2.2 Selecting Soft Start Setting: CSS and CSS,VEE
- 9.2.2.3 Selecting VDS Switch Over Threshold
- 9.2.2.4 Timer Selection
- 9.2.2.5 MOSFET Selection and SOA Checks
- 9.2.2.6 EMI Filter Consideration
- 9.2.2.7 Under Voltage and Over Voltage Settings
- 9.2.2.8 Choosing RVCC and CVCC
- 9.2.2.9 Power Good Interface to Downstream DC/DC
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PW|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8.3.4 Gate 2
The TPS23521 features a second hot swap Gate drive, which can be used to save BOM cost and size in applications that require multiple hot swap MOSFETs. The 2nd MOSFET is only turned ON when the main FET is enhanced. As a result the 2nd MOSFET doesn't operate with large current and large voltage across it, thus reducing the SOA requirements. In many cases a 5x6 QFN FET can replace a D2PACK FET. The following figures show the operation during start-up and Hot Short event. It can be seen that the second FET is OFF during stressful operation and turns on during normal operation to improve steady state efficiency and reduce power losses.
Figure 9. Gate 2 Operation During Start-Up
Figure 10. Gate2 Operation During Hot Short