SLVSHZ1A June 2024 – July 2025 TPS1HTC100-Q1
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|14
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|14
訂購(gòu)信息
8.4.2.1 Without a GND Network
Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.
Figure 8-5 Layout Without a GND Network