ZHCSD47E December 2014 – October 2022 TPD2E2U06-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPD2E2U06-Q1 | UNIT | ||
|---|---|---|---|---|
| DBZ (SOT23) | DCK (SC70) | |||
| 3 PINS | 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 439.5 | 308.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 194.9 | 170.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 173.9 | 89.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 53.7 | 34.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 172 | 88.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |