ZHCSAA4B September 2012 – September 2015 TPA3110D2-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 TPA3110D2-Q1 Modulation Scheme
- 8.2.2.2 Ferrite Bead Filter Considerations
- 8.2.2.3 Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
- 8.2.2.4 When to Use an Output Filter for EMI Suppression
- 8.2.2.5 Input Resistance
- 8.2.2.6 Input Capacitor, CI
- 8.2.2.7 BSN and BSP Capacitors
- 8.2.2.8 Differential Inputs
- 8.2.2.9 Using Low-ESR Capacitors
- 8.2.3 Application Curve
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
訂購信息
11.5 靜電放電警告
這些裝置包含有限的內(nèi)置 ESD 保護(hù)。 存儲(chǔ)或裝卸時(shí)，應(yīng)將導(dǎo)線一起截短或?qū)⒀b置放置于導(dǎo)電泡棉中，以防止 MOS 門極遭受靜電損傷。