ZHCSMZ0C January 2021 – December 2024 TMUX7219-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Thermal Information
- 5.4 Recommended Operating Conditions
- 5.5 Source or Drain Continuous Current
- 5.6 ±15 V Dual Supply: Electrical Characteristics?
- 5.7 ±15 V Dual Supply: Switching Characteristics?
- 5.8 ±20 V Dual Supply: Electrical Characteristics
- 5.9 ±20 V Dual Supply: Switching Characteristics
- 5.10 44 V Single Supply: Electrical Characteristics?
- 5.11 44 V Single Supply: Switching Characteristics?
- 5.12 12 V Single Supply: Electrical Characteristics?
- 5.13 12 V Single Supply: Switching Characteristics?
- 5.14 Typical Characteristics
-
6 Parameter Measurement Information
- 6.1 On-Resistance
- 6.2 Off-Leakage Current
- 6.3 On-Leakage Current
- 6.4 Transition Time
- 6.5 tON(EN) and tOFF(EN)
- 6.6 Break-Before-Make
- 6.7 tON (VDD) Time
- 6.8 Propagation Delay
- 6.9 Charge Injection
- 6.10 Off Isolation
- 6.11 Crosstalk
- 6.12 Bandwidth
- 6.13 THD + Noise
- 6.14 Power Supply Rejection Ratio (PSRR)
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DGK|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
4 Pin Configuration and Functions
Figure 4-1 DGK Package, 8-Pin VSSOP
(Top View)Table 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION (2) | ||
|---|---|---|---|---|
| NAME | DGK | |||
| D | 1 | I/O | Drain pin. Can be an input or output. | |
| S1 | 2 | I/O | Source pin 1. Can be an input or output. | |
| GND | 3 | P | Ground (0 V) reference | |
| VDD | 4 | P | Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VDD and GND. | |
| EN | 5 | I | Active high logic enable, has internal pull-up resistor. When this pin is low, all switches are turned off. When this pin is high, the SEL logic input determine which switch is turned on. | |
| SEL | 6 | I | Logic control input, has internal pull-down resistor. Controls the switch connection as shown in Section 7.5. | |
| VSS | 7 | P | Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VSS and GND. | |
| S2 | 8 | I/O | Source pin 2. Can be an input or output. | |
| Thermal Pad | — | — | The thermal pad is not connected internally. There is no requirement to electrically connect this pad. If connected, it is recommended that the pad be left floating or tied to GND. | |
(1) I = input, O = output, I/O = input and output, P = power.
(2) Refer to Section 7.4 for
what to do with unused pins.