ZHCSKY9E March 2020 – October 2022 TMUX1308 , TMUX1309
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information: TMUX1308
- 7.5 Thermal Information: TMUX1309
- 7.6 Electrical Characteristics
- 7.7 Logic and Dynamic Characteristics
- 7.8 Timing Characteristics
- 7.9 Injection Current Coupling
- 7.10 Typical Characteristics
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Bidirectional Operation
- 9.3.2 Rail-to-Rail Operation
- 9.3.3 1.8 V Logic Compatible Inputs
- 9.3.4 Fail-Safe Logic
- 9.3.5
Injection Current Control
- 9.3.5.1 TMUX13xx is Powered, Channel is Unselected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
- 9.3.5.2 TMUX13xx is Powered, Channel is Selected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
- 9.3.5.3 TMUX13xx is Unpowered and the Input Signal has a Voltage Present (VDD = 0 V, VINPUT = 3 V)
- 9.4 Device Functional Modes
- 9.5 Truth Tables
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- BQB|16
訂購信息
13.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |