ZHCSA58F June 2006 – May 2018 TMP275
PRODUCTION DATA.
| THERMAL METRIC(1) | TMP275 | UNIT | |
|---|---|---|---|
| D (SOIC) AND DGK (VSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 120 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |