ZHCSI62J August 2018 – February 2024 TLV9051 , TLV9052 , TLV9054
PRODUCTION DATA
| THERMAL METRIC(1) | TLV9052, TLV9052S | UNIT | |||||||
|---|---|---|---|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | DSG (WSON) | PW (TSSOP) | DDF (SOT-23) | DGS (VSSOP) | RUG (X2QFN) | |||
| 8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | 10 PINS | 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 155.4 | 208.8 | 102.3 | 205.1 | 184.4 | 170.4 | 197.2 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 95.5 | 93.3 | 120.0 | 93.7 | 112.8 | 84.9 | 93.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 98.9 | 130.7 | 68.2 | 135.7 | 99.9 | 113.5 | 123.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 41.9 | 26.1 | 15.1 | 25.0 | 18.7 | 16.4 | 3.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 98.1 | 128.9 | 68.2 | 134.0 | 99.3 | 112.3 | 120.2 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | N/A | 43.6 | N/A | N/A | N/A | N/A | °C/W |