ZHCS187E april 2011 – december 2020 TLV803 , TLV853
PRODUCTION DATA
| THERMAL METRIC(1) | TLV8x3 | UNITS | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 328.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 135.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 5.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |