ZHCSA82F September 2012 – August 2019 TLV713
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV713, TLV713P | UNIT | ||
|---|---|---|---|---|
| DQN (X2SON) | DBV (SOT23) | |||
| 4 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 255.8 | 249 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 159.3 | 172.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 208.2 | 76.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 16.2 | 49.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 208.1 | 75.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 148.6 | n/a | °C/W |