SBVS305 March 2017 TLV703
PRODUCTION DATA.
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage(2) | IN, EN, OUT | –0.3 | 6 | V |
| Current (source) | OUT | Internally limited | ||
| Output short-circuit duration | Indefinite | |||
| Total continuous power dissipation | See Thermal Information | |||
| Temperature | Operating virtual junction, TJ | –55 | 150 | °C |
| Storage, Tstg | –55 | 150 | ||
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input voltage range | 2 | 5.5 | V | |
| VOUT | Output voltage range | 1.2 | 4.8 | V | |
| IOUT | Output current | 0 | 300 | mA | |
| THERMAL METRIC(1) | TLV703 | UNIT | |
|---|---|---|---|
| DBV (SOT-23) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 254.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 143.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 25.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| VIN | Input voltage range | 2 | 5.5 | V | ||||
| VOUT | DC output accuracy | –40°C ≤ TJ ≤ 125°C | –2% | 0.5% | 2% | |||
| ΔVOUT(ΔVIN) | Line regulation | VOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA |
1 | 5 | mV | |||
| ΔVOUT(ΔIOUT) | Load regulation | 0 mA ≤ IOUT ≤ 300 mA | 1 | 15 | mV | |||
| VDO | Dropout voltage(1) | VIN = 0.98 × VOUT(nom), IOUT = 300 mA | 260 | 375 | mV | |||
| ICL | Output current limit | VOUT = 0.9 × VOUT(nom) | 320 | 500 | 860 | mA | ||
| IGND | Ground pin current | IOUT = 0 mA | 35 | 55 | µA | |||
| IOUT = 300 mA, VIN = VOUT + 0.5 V | 370 | |||||||
| ISHDN | Ground pin current (shutdown) | VEN ≤ 0.4 V, VIN = 2 V | 400 | nA | ||||
| VEN ≤ 0.4 V, 2 V ≤ VIN ≤ 4.5 V, TJ = –40°C to +85°C |
1 | 2 | µA | |||||
| PSRR | Power-supply rejection ratio | VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA, f = 1 kHz |
68 | dB | ||||
| Vn | Output noise voltage | BW = 100 Hz to 100 kHz, VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA |
48 | µVRMS | ||||
| tSTR | Start-up time(2) | COUT = 1 µF, IOUT = 300 mA | 100 | µs | ||||
| VEN(high) | Enable pin high (enabled) | 0.9 | VIN | V | ||||
| VEN(low) | Enable pin low (disabled) | 0 | 0.4 | V | ||||
| IEN | Enable pin current | VIN = VEN = 5.5 V | 0.04 | µA | ||||
| UVLO | Undervoltage lockout | VIN rising | 1.9 | V | ||||
| Tsd | Thermal shutdown temperature | Shutdown, temperature increasing | 165 | °C | ||||
| Reset, temperature decreasing | 145 | |||||||
| TJ | Operating junction temperature | –40 | 125 | °C | ||||
| VOUT = 1.8 V, IOUT = 10 mA |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VIN – VOUT = 0.5 V |
| VOUT = 1.8 V, IOUT = 10 mA, CIN = COUT = 1 µF |
| VOUT = 1.8 V, tR = tF = 1 µs |
| VOUT = 1.8 V, tR = tF = 1 µs |
| VOUT = 1.8 V, IOUT = 1 mA, slew rate = 1 V/µs |
| VOUT = 1.8 V, IOUT = 1 mA |
| VOUT = 1.8 V, IOUT = 300 mA |
| IOUT = 300 mA |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VOUT = 1.8 V |
| VOUT = 1.8 V | ||
| VOUT = 1.8 V, tR = tF = 1 µs |
| VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs |
| VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs |