SBVS305 March 2017 TLV703
PRODUCTION DATA.
9 Power Supply Recommendations
Connect a low output impedance power supply directly to the IN pin of the TLV703. Inductive impedances between the input supply and the IN pin can create significant voltage excursions at the IN pin during start-up or load transient events.
9.1 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air; see the Thermal Information section for thermal performance on the TLV703 evaluation module (EVM). The EVM is a two-layer board with two ounces of copper per side.
Power dissipation depends on input voltage and load conditions. Equation 1 shows that power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element.
