ZHCSGK4E September 2017 – November 2019 TLV7011 , TLV7012 , TLV7021 , TLV7022
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV7012/TLV7022 | UNIT | |
|---|---|---|---|
| DGK (VSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 211.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 96.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 133.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 28.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 131.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |