ZHCSFK1D July 2016 – January 2025
PRODUCTION DATA
| THERMAL METRIC(1) | TLV700xx-Q1 | UNIT | |
|---|---|---|---|
| DDC (SOT) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 262.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 68.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 81.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 80.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |