ZHCSHH1B January 2018 – November 2019 TLV6700
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV6700 | UNIT | |||
|---|---|---|---|---|---|
| DDC
(SOT) |
DSE
(WSON) |
||||
| 6 PINS | 6 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 204.6 | 194.9 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.5 | 128.9 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 54.3 | 153.8 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 0.8 | 11.9 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 52.8 | 157.4 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W | |