ZHCSGK2F November 2019 – November 2019 TLV62585
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV62585 | UNIT | ||
|---|---|---|---|---|
| RWT [QFN] | DRL [SOT] | |||
| RθJA | Junction-to-ambient thermal resistance | 95.7 | 132.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 74.1 | 43.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 29.4 | 27.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 5.8 | 1.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 29.7 | 26.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |