ZHCSFR4C DECEMBER 2016 – October 2017 TLV62569
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component.
Two basic approaches for enhancing thermal performance are listed below:
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics Application Notes SZZA017 and SPRA953.