ZHCS760H February 2012 – June 2018 TLV62130 , TLV62130A
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV62130 | UNIT | |
|---|---|---|---|
| RGT [VQFN] | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 45 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 53.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 17.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 17.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.5 | °C/W |