SLAS647C December 2009 – May 2016 TLV320AIC3110
PRODUCTION DATA.
- 1 Device Overview
- 2 Revision History
- 3 Device Comparison
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 Electrical Characteristics
- 5.6 Power Dissipation Ratings
- 5.7 I2S, LJF, and RJF Timing in Master Mode
- 5.8 I2S, LJF, and RJF Timing in Slave Mode
- 5.9 DSP Timing in Master Mode
- 5.10 DSP Timing in Slave Mode
- 5.11 I2C Interface Timing
- 5.12 Typical Characteristics
- 6 Parameter Measurement Information
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Power-Supply Sequence
- 7.3.2 Reset
- 7.3.3 Device Start-Up Lockout Times
- 7.3.4 PLL Start-Up
- 7.3.5 Power-Stage Reset
- 7.3.6 Software Power Down
- 7.3.7 Audio Analog I/O
- 7.3.8
Digital Processing Low-Power Modes
- 7.3.8.1 ADC, Mono, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V
- 7.3.8.2 ADC, Mono, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V
- 7.3.8.3 DAC Playback on Headphones, Stereo, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
- 7.3.8.4 DAC Playback on Headphones, Mono, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
- 7.3.8.5 DAC Playback on Headphones, Stereo, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
- 7.3.8.6 DAC Playback on Headphones, Mono, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
- 7.3.8.7 DAC Playback on Headphones, Stereo, 192 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
- 7.3.8.8 DAC Playback on Line Out (10 k-? load), Stereo, 48 kHz, DVDD = 1.8 V, AVDD = 3 V, HPVDD = 3 V
- 7.3.9
Audio ADC and Analog Inputs
- 7.3.9.1 MICBIAS and Microphone Preamplifier
- 7.3.9.2 Automatic Gain Control (AGC)
- 7.3.9.3 Delta-Sigma ADC
- 7.3.9.4
ADC Decimation Filtering and Signal Processing
- 7.3.9.4.1 ADC Processing Blocks
- 7.3.9.4.2
ADC Processing Blocks - Signal Chain Details
- 7.3.9.4.2.1 First-Order IIR, AGC, Filter A
- 7.3.9.4.2.2 Five Biquads, First-Order IIR, AGC, Filter A
- 7.3.9.4.2.3 25-Tap FIR, First-Order IIR, AGC, Filter A
- 7.3.9.4.2.4 First-Order IIR, AGC, Filter B
- 7.3.9.4.2.5 Three Biquads, First-Order IIR, AGC, Filter B
- 7.3.9.4.2.6 20-Tap FIR, First-Order IIR, AGC, Filter B
- 7.3.9.4.2.7 First-Order IIR, AGC, Filter C
- 7.3.9.4.2.8 Five Biquads, First-Order IIR, AGC, Filter C
- 7.3.9.4.2.9 25-Tap FIR, First-Order IIR, AGC, Filter C
- 7.3.9.4.3 User-Programmable Filters
- 7.3.9.4.4 ADC Digital Decimation Filter Characteristics
- 7.3.9.4.5 ADC Data Interface
- 7.3.9.5 Updating ADC Digital Filter Coefficients During Record
- 7.3.9.6 Digital Microphone Function
- 7.3.9.7 DC Measurement
- 7.3.10
Audio DAC and Audio Analog Outputs
- 7.3.10.1
DAC
- 7.3.10.1.1 DAC Processing Blocks
- 7.3.10.1.2
DAC Processing Blocks — Details
- 7.3.10.1.2.1 Three Biquads, Filter A
- 7.3.10.1.2.2 Six Biquads, First-Order IIR, DRC, Filter A or B
- 7.3.10.1.2.3 Six Biquads, First-Order IIR, Filter A or B
- 7.3.10.1.2.4 IIR, Filter B or C
- 7.3.10.1.2.5 Four Biquads, DRC, Filter B
- 7.3.10.1.2.6 Four Biquads, Filter B
- 7.3.10.1.2.7 Four Biquads, First-Order IIR, DRC, Filter C
- 7.3.10.1.2.8 Four Biquads, First-Order IIR, Filter C
- 7.3.10.1.2.9 Two Biquads, 3D, Filter A
- 7.3.10.1.2.10 Five Biquads, DRC, 3D, Filter A
- 7.3.10.1.2.11 Five Biquads, DRC, 3D, Beep Generator, Filter A
- 7.3.10.1.3 DAC User-Programmable Filters
- 7.3.10.1.4 DAC Interpolation Filter Characteristics
- 7.3.10.2 DAC Digital-Volume Control
- 7.3.10.3 Volume Control Pin
- 7.3.10.4 Dynamic Range Compression
- 7.3.10.5 Headset Detection
- 7.3.10.6 Interrupts
- 7.3.10.7 Key-Click Functionality With Digital Sine-Wave Generator (PRB_P25)
- 7.3.10.8 Programming DAC Digital Filter Coefficients
- 7.3.10.9 Updating DAC Digital Filter Coefficients During PLAY
- 7.3.10.10 Digital Mixing and Routing
- 7.3.10.11 Analog Audio Routing
- 7.3.10.12 Analog Outputs
- 7.3.10.13 Audio-Output Stage-Power Configurations
- 7.3.10.14 Example Register Setup to Play Digital Data Through DAC and Headphone/Speaker Outputs
- 7.3.10.1
DAC
- 7.3.11 CLOCK Generation and PLL
- 7.3.12 Timer
- 7.3.13 Digital Audio and Control Interface
- 7.4
Register Map
- 7.4.1 TLV320AIC3110 Register Map
- 7.4.2
Registers
- 7.4.2.1 Control Registers, Page 0 (Default Page): Clock Multipliers, Dividers, Serial Interfaces, Flags, Interrupts, and GPIOs
- 7.4.2.2 Control Registers, Page 1: DAC and ADC Routing, PGA, Power-Controls, and MISC Logic-Related Programmability
- 7.4.2.3 Control Registers, Page 3: MCLK Divider for Programmable Delay Timer
- 7.4.2.4 Control Registers, Page 4: ADC Digital Filter Coefficients
- 7.4.2.5 Control Registers, Page 8: DAC Digital Filter Coefficients
- 7.4.2.6 Control Registers, Page 9: DAC Digital Filter Coefficients
- 7.4.2.7 Control Registers, Page 12: DAC Programmable Coefficients Buffer B (1:63)
- 7.4.2.8 Control Registers, Page 13: DAC Programmable Coefficients RAM Buffer B (65:127)
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical Packaging and Orderable Information
11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
-
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
-
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
MATLAB is a trademark of The MathWorks, Inc.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.4 Glossary
-
TI Glossary This glossary lists and explains terms, acronyms, and definitions.