SLAS553B November   2008  – August 2015 TLV320ADC3101

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Description (continued)
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Thermal Information
   5. 8.5  Electrical Characteristics
   6. 8.6  Dissipation Ratings
   7. 8.7  I2S/LJF/RJF Timing in Master Mode
   8. 8.8  DSP Timing in Master Mode
   9. 8.9  I2S/LJF/RJF Timing in Slave Mode
   10. 8.10 DSP Timing in Slave Mode
   11. 8.11 Typical Characteristics
9. 9 Parameter Measurement Information
10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
       1. 10.3.1  Hardware Reset
       2. 10.3.2  PLL Start-up
       3. 10.3.3  Software Power Down
       4. 10.3.4  miniDSP
       5. 10.3.5  Audio Data Converters
       6. 10.3.6  Digital Audio Data Serial Interface
          1. 10.3.6.1 Right-Justified Mode
          2. 10.3.6.2 Left-Justified Mode
          3. 10.3.6.3 I2S Mode
          4. 10.3.6.4 DSP Mode
       7. 10.3.7  Audio Clock Generation
       8. 10.3.8  Stereo Audio ADC
       9. 10.3.9  Audio Analog Inputs
          1. 10.3.9.1 Digital Volume Control
          2. 10.3.9.2 Fine Digital Gain Adjustment
          3. 10.3.9.3 AGC
       10. 10.3.10 Input Impedance and VCM Control
       11. 10.3.11 MICBIAS Generation
       12. 10.3.12 ADC Decimation Filtering and Signal Processing
           1. 10.3.12.1 Processing Blocks
           2. 10.3.12.2 Processing Blocks - Details
              1. 10.3.12.2.1 First-Order IIR, AGC, Filter A
              2. 10.3.12.2.2 Five Biquads, First-Order IIR, AGC, Filter A
              3. 10.3.12.2.3 25-Tap FIR, First-Order IIR, AGC, Filter A
              4. 10.3.12.2.4 First-Order IIR, AGC, Filter B
              5. 10.3.12.2.5 Three Biquads, First-Order IIR, AGC, Filter B
              6. 10.3.12.2.6 20-Tap FIR, First-Order IIR, AGC, Filter B
              7. 10.3.12.2.7 First-Order IIR, AGC, Filter C
              8. 10.3.12.2.8 Five Biquads, First-Order IIR, AGC, Filter C
              9. 10.3.12.2.9 25-Tap FIR, First-Order IIR, AGC, Filter C
           3. 10.3.12.3 User-Programmable Filters
              1. 10.3.12.3.1 First-Order IIR Section
              2. 10.3.12.3.2 Biquad Section
              3. 10.3.12.3.3 FIR Section
           4. 10.3.12.4 Decimation Filter
              1. 10.3.12.4.1 Decimation Filter A
              2. 10.3.12.4.2 Decimation Filter B
              3. 10.3.12.4.3 Decimation Filter C
           5. 10.3.12.5 ADC Data Interface
           6. 10.3.12.6 Digital Microphone Function
    4. 10.4 Device Functional Modes
       1. 10.4.1 Recording Mode
    5. 10.5 Programming
       1. 10.5.1 Digital Control Serial Interface
          1. 10.5.1.1 I2C Control Mode
    6. 10.6 Register Maps
       1. 10.6.1 Control Registers
       2. 10.6.2 Control Registers, Page 0: Clock Multipliers and Dividers, Serial Interfaces, Flags, Interrupts and Programming of GPIOs
       3. 10.6.3 CONTROL REGISTERS Page 1: ADC Routing, PGA, Power-Controls, Etc.
       4. 10.6.4 Control Registers, Page 4: ADC Digital Filter Coefficients
       5. 10.6.5 Control Registers, Page 5: ADC Programmable Coefficients RAM (65:127)
       6. 10.6.6 Control Registers, Page 32: ADC DSP Engine Instruction RAM (0:31)
          1. 10.6.6.1 Page 32 / Register 5 Through Page 32 / Register 97
       7. 10.6.7 Control Registers, Pages 33-47: ADC DSP Engine Instruction RAM (32:63) Through (480:511)
11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
       1. 11.2.1 Design Requirements
       2. 11.2.2 Detailed Design Procedure
          1. 11.2.2.1 Step 1
          2. 11.2.2.2 Step 2
          3. 11.2.2.3 Example Register Setup to Record Analog Data Through ADC to Digital Out
          4. 11.2.2.4 MICBIAS
          5. 11.2.2.5 Decoupling Capacitors
       3. 11.2.3 Application Curves
12. 12Power Supply Recommendations
13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
14. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
15. 15Mechanical, Packaging, and Orderable Information