ZHCSP57A october 2006 – may 2023 TLV3011-EP , TLV3012-EP
PRODUCTION DATA
| THERMAL METRIC1 | TLV3011-EP | TLV3012-EP | UNIT | |
|---|---|---|---|---|
| DBV (SOT-23) | DBV | |||
| 6 PINS | 6 PINS | |||
| R θJA | Junction-to-ambient thermal resistance | 191.9 | 162.5 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 123.9 | 78.8 | °C/W |
| R θJB | Junction-to-board thermal resistance | 38.7 | 42.1 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 21.2 | 21.2 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 38.2 | 41.9 | °C/W |