ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2374 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | N (PDIP) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 67 | 66.3 | 121 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 24.1 | 20.5 | 49.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.5 | 26.8 | 62.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.2 | 2.1 | 5.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 22.1 | 26.2 | 62.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |