ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2372 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | P (PDIP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 138.4 | 191.2 | 49.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 89.5 | 61.9 | 39.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 78.6 | 111.9 | 26.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 29.9 | 5.1 | 15.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 78.1 | 110.2 | 26.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |