ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2373 | UNIT | |||
|---|---|---|---|---|---|
| DGS (VSSOP) | D (SOIC) | P (PDIP) | |||
| 10 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 166.5 | 67 | 66.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.8 | 24.1 | 20.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 86.1 | 22.5 | 26.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | 2.2 | 2.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 84.7 | 22.1 | 26.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |