ZHCS055C May 2011 – January 2023 TLV1117LV
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- DCY|4
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DCY|4
訂購信息
8.5.1.2 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low and high-K boards are given in the Section 6.4 table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves heat-sink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1:
