ZHCS055C May 2011 – January 2023 TLV1117LV
PRODUCTION DATA
| THERMAL METRIC(1) | TLV1117LV | UNIT | |
|---|---|---|---|
| DCY (SOT-223) | |||
| 4 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 62.9 | °C/W |
| θJCtop | Junction-to-case (top) thermal resistance | 47.2 | °C/W |
| RθJC(top) | Junction-to-board thermal resistance | 12 | °C/W |
| ψJT | Junction-to-top characterization parameter | 6.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 11.9 | °C/W |