Use of a 4-layer board is recommended for good heat conduction. Use layer 1 (top layer) for control signals, layer 2 as GND, layer 3 for the 24-V supply plane (VCC), and layer 4 for the regulated output supply (VCC_IN/OUT).
Connect the thermal pad to GND with maximum amount of thermal vias for best thermal performance.
Use entire planes for VCC, VCC_IN/OUT and GND to assure minimum inductance.
The VCC terminal must be decoupled to ground with a low-ESR ceramic decoupling capacitor with a minimum value of 100 nF. The capacitor must have a voltage rating of 50 V minimum (100 V depending on max sensor supply fault rating) and an X5R or X7R dielectric.
? The optimum placement of the capacitor is closest to the VCC and GND terminals to reduce supply drops during large supply current loads. See Figure 11-1 for a PCB layout example.
Connect all open-drain control outputs via 10 kΩ pull-up resistors to the VCC_IN/OUT plane to provide a defined voltage potential to the system controller inputs when the outputs are high-impedance.
Connect the RSET resistor between ILIM_ADJ and GND.
Decouple the regulated output voltage at VCC_IN/OUT to ground with a low-ESR, 1 μF, ceramic decoupling capacitor. The capacitor should have a voltage rating of 10 V minimum and an X5R or X7R dielectric.