ZHCSOO2B December 2022 – March 2024 THVD2410V , THVD2412V , THVD2450V , THVD2452V
PRODUCTION DATA
| THERMAL METRIC(1) | THVD2410V THVD2450V |
THVD2412V THVD2452V |
UNIT | |
|---|---|---|---|---|
| DRC (VSON) |
D (SOIC) |
|||
| 10 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 46.7 | 87.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.7 | 41.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.1 | 43.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.7 | 8.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 19.1 | 43.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.6 | N/A | °C/W |