ZHCSPL9A January 2024 – August 2024 THVD2419 , THVD2429
PRODUCTION DATA
| THERMAL METRIC(1) | THVD2419, THVD2429 | UNIT | ||
|---|---|---|---|---|
| DRC (VSON) | D (SOIC) | |||
| 10 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 65.2 | 117.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.7 | 40.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 36.4 | 65.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.4 | 3.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 36.3 | 64.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 24.9 | N/A | °C/W |