ZHCSNY7 September 2023 THVD1330
PRODUCTION DATA
| THERMAL METRIC(1) | THVD1330 | UNIT | |
|---|---|---|---|
| D (SOIC) |
|||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 62.6 | °C/W |