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ZHCSDF0C February 2015 – August 2015 TDC7200

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

PW|14
- MPDS360A

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings

T_A = 25°C , VDD = 3.3V, GND = 0V (unless otherwise noted).⁽¹⁾⁽²⁾⁽³⁾

		MIN	MAX	UNIT
V_DD	Supply voltage	–0.3	3.9	V
V_I	Terminal input voltage	–0.3	V_DD+0.3	V
V_{DIFF_IN}	\|Voltage differential\| between any two input terminals		3.9	V
V_{IN_GND_VDD}	\|Voltage differential\| between any input terminal and GND or VDD		3.9	V
I_I	Input current at any pin	–5	5	mA
T_A	Ambient temperature	-40	125	°C
T_stg	Storage temperature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum

(3) All voltages are with respect to ground, unless otherwise specified.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±250	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

T_A = 25°C , VDD = 3.3V, GND = 0V (unless otherwise noted).

		MIN	NOM	MAX	UNIT
V_DD	Supply voltage	2		3.6	V
V_I	Terminal voltage	0		VDD	V
V_IH	Voltage input high	0.7 × VDD		3.6	V
V_IL	Voltage input low	0		0.3 × VDD	V
F_{CALIB_CLK}	Frequency (Reference/Calibration Clock)	1 ⁽¹⁾	8	16	MHz
DUTY_CLOCK	Input clock duty cycle		50%
TIMING REQUIREMENTS: Measurement Mode 1 ⁽¹⁾
T1_{STARTSTOP_Min}	Minimum Time between Start and Stop Signal	12			ns
T1_{STOPSTOP_Min}	Minimum Time between 2 Stop Signals	67			ns
T1_{STARTSTOP_Max}	Maximum time bet. Start and Stop Signal			500	ns
T1_{STOPSTOP_Max}	Maximum time bet. Start and last Stop Signal			500	ns
TIMING REQUIREMENTS: Measurement 2 ⁽¹⁾
T2_{STARTSTOP_Min}	Minimum Time between Start and Stop Signal	2×t_CLOCK			s
T2_{STOPSTOP_Min}	Minimum Time between 2 Stop Signals	2×t_CLOCK			s
T2_{STARTSTOP_Max}	Maximum time bet. Start and Stop Signal			(2¹⁶-2)×t_CLOCK	s
T2_{STOPSTOP_Max}	Maximum. time bet. Start and last Stop Signal			(2¹⁶-2)×t_CLOCK	s
TIMING REQUIREMENTS: ENABLE INPUT
T_REN	Rise Time for Enable Signal (20%-80%)		1 to 100		ns
T_FEN	Fall Time for Enable Signal (20%-80%)		1 to 100		ns
TIMING REQUIREMENTS: START, STOP, CLOCK
T_RST, T_FST	Maximum rise, fall time for START, STOP signals (20%-80%)		1		ns
T_RXCLK, T_FXCLK	Maximum rise, fall time for external CLOCK (20%-80%)		1		ns
TIMING REQUIREMENTS: TRIGG
T_TRIGSTART	Time from TRIG to START		5		ns
TEMPERATURE
T_A	Ambient temperature	–40		85	°C
T_J	Junction temperature	–40		85	°C

7.4 Thermal Information

THERMAL METRIC⁽²⁾		TDC7200	UNIT
		PW [TSSOP]
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	134.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	63
R_θJB	Junction-to-board thermal resistance	76.8
ψ_JT	Junction-to-top characterization parameter	12.4
ψ_JB	Junction-to-board characterization parameter	76.2
θ_JA	Package thermal impedance	113

(1) Specified by design.

(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

T_A = 25°C , VDD = 3.3 V, GND = 0 V (unless otherwise noted).

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
TDC CHARACTERISTICS
LSB	Resolution	Single shot measurement		55		ps
T_ACC-2	Accuracy (Mode 2) ⁽¹⁾	CLOCK = 8 MHz		28		ps
T_STD-2	Standard Deviation (Mode 2)	Measured time = 100 µs		50		ps
T_STD-2	Standard Deviation (Mode 2)	Measured time = 1 µs		35		ps
OUTPUT CHARACTERISTICS: TRIGG, INTB, DOUT
V_OH	Output voltage high	Isource = -2 mA	2.31	2.95		V
V_OL	Output voltage low	Isink = 2 mA		0.35	0.99	V
INPUT CHARACTERISTICS: ENABLE, START, STOP, CLOCK, DIN, CSB,SCLK
C_in	Input capacitance ⁽²⁾			3		pF
POWER CONSUMPTION (see Measurement Mode 1 and Measurement Mode 2)
I_sh	Shutdown current	EN = LOW		0.3	2	µA
I_QA	Quiescent Current A	EN = HIGH; TDC running		1.35		mA
I_QB	Quiescent Current B	EN = HIGH; TDC OFF, Clock Counter running		71		µA
I_QC	Quiescent Current C	EN = HIGH; measurement stopped, SPI communication only		87		µA
I_QD	Quiescent Current D	TDC OFF, counter stopped, no communication		50		µA

7.6 Timing Requirements

		MIN	MAX	UNIT
TIMING REQUIREMENTS: START, STOP INPUTS, CLOCK
PW_START	Pulse width for Start Signal	10		ns
PW_STOP	Pulse width for Stop Signal	10		ns
SERIAL INTERFACE TIMING CHARACTERISTICS (VDD = 3.3 V, f_SCLK = 20 MHz) (See Figure 1)
f_SCLK	SCLK Frequency		20	MHz
t₁	SCLK period	50		ns
t₂	SCLK High Time	16		ns
t₃	SCLK Low Time	16		ns
t₄	DIN setup time	4		ns
t₅	DIN hold time	4		ns
t₆	CSB fall to SCLK rise	6		ns
t₇	Last SCLK rising edge to CSB rising edge	6		ns
t₈	Minimum pause time (CSB high)	40		ns
t₉	Clk fall to DOUT bus transition		12	ns

(1) Accuracy is defined as the systematic error in the output signal; the error of the device excluding noise.

(2) Specified by design.

7.7 Switching Characteristics

T_A = 25°C , VDD = 3.3 V, GND = 0 V (unless otherwise noted).

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
WAKE UP TIME
T_{WAKEUP_PERIOD}	Time to be ready for Measurement	LSB within 0.3% of settled value		300		µs

Figure 1. SPI Register Write: 8 bit Register Example

7.8 Typical Characteristics

T_A = 25°C , VDD = 3.3 V, GND = 0 V, CLOCK = 8 MHz, CALIBRATION2_PERIODS = 10, AVG_CYCLES = 1 Measurement, NUM_STOP = Single STOP, Measurement Mode 2 (unless otherwise noted).