ZHCSEG6F December 2015 – May 2025 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G
PRODUCTION DATA
- 1
- 1特性
- 2應(yīng)用
- 3說明
- Device Options
- 4Pin Configuration and Functions
- 5Specifications
- Parameter Measurement Information
- 6Detailed Description
- 7Application Information Disclaimer
- Device and Documentation Support
- 8Revision History
- 9Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DCN|8
訂購信息
6.3.8 ESD Protection
The bus pins of the TCAN33x family possess on-chip ESD protection against ±25kV human body model (HBM) and ±12kV IEC61000-4-2 contact discharge. The IEC-ESD test is far more severe than the HBM-ESD test. The 50% higher charge capacitance, CS, and 78% lower discharge resistance, RD of the IEC model produce significantly higher discharge currents than the HBM-model.
As stated in the IEC 61000-4-2 standard, contact discharge is the preferred test method; although IEC air-gap testing is less repeatable than contact testing, air discharge protection levels are inferred from the contact discharge test results.
Figure 6-2 HBM and IEC-ESD Models and Currents in Comparison (HBM Values in Parenthesis)