ZHCSIR6C September 2018 – February 2022 TCAN1046V-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TCAN1046V-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DMT (VSON) | |||
| RθJA | Junction-to-ambient thermal resistance | 70.8 | 34.8 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33 | 38.2 | ℃/W |
| RθJB | Junction-to-board thermal resistance | 32.9 | 12.8 | ℃/W |
| ΨJT | Junction-to-top characterization parameter | 5.9 | 2.0 | ℃/W |
| ΨJB | Junction-to-board characterization parameter | 32.5 | 12.8 | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | 3.1 | ℃/W |