ZHCSLW4A March 2020 – September 2020 TCAN1046-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TCAN1046-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DMT (VSON) | |||
| RθJA | Junction-to-ambient thermal resistance | 70.6 | 35.5 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.4 | 38.1 | ℃/W |
| RθJB | Junction-to-board thermal resistance | 34.0 | 13.4 | ℃/W |
| ΨJT | Junction-to-top characterization parameter | 5.0 | 1.9 | ℃/W |
| ΨJB | Junction-to-board characterization parameter | 32.6 | 13.4 | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | 3.5 | ℃/W |