Primarily, the goal of the PCB design is to
minimize the thermal impedance in the path to those cooler structures. These tips must be
followed to achieve that goal:
- Avoid placing other heat producing components or structures near the
amplifier (including above or below in the end equipment).
- If possible, use a higher layer count PCB to provide more heat
sinking capability for the TAS5825P device and to prevent traces and copper signal and
power planes from breaking up the contiguous copper on the top and bottom layer.
- Place the TAS5825P device away from the edge of the PCB when possible
to make sure that the heat can travel away from the device on all four sides.
- Avoid cutting off the flow of heat from the TAS5825P device to the
surrounding areas with traces or via strings. Instead, route traces perpendicular to the
device and line up vias in columns which are perpendicular to the device.
- Unless the area between two pads of a passive component is large
enough to allow copper to flow in between the two pads, orient the pads so that the
narrow end of the passive component is facing the TAS5825P device.
- Because the ground pins are the best conductors of heat in the
package, maintain a contiguous ground plane from the ground pins to the PCB area
surrounding the device for as many of the ground pins as possible.