| MIN(1)(2) | MAX | UNIT |
|---|
| VIN, UVLO to RTN | –0.3 | 53 | V |
| SW to RTN | –1.5 | VIN +0.3 | V |
| SW to RTN (100-ns transient) | –5 | VIN +0.3 | V |
| BST to VCC | | 53 | V |
| BST to SW | | 13 | V |
| RON to RTN | –0.3 | 53 | V |
| VCC to RTN | –0.3 | 13 | V |
| FB to RTN | –0.3 | 5 | V |
| Maximum junction
temperature(3) | | 150 | °C |
| Storage temperature, Tstg | –55 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
(3) The RTN pin is the GND reference electrically connected to the substrate.