ZHCSQI5I August 1990 – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176
PRODUCTION DATA
| THERMAL METRIC(1) | FK | JG | UNIT | |
|---|---|---|---|---|
| 20 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 61.6 | 99.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.8 | 51.5 | |
| RθJB | Junction-to-board thermal resistance | 36.1 | 86.5 | |
| ψJT | Junction-to-top characterization parameter | 31.0 | 23.7 | |
| ψJB | Junction-to-board characterization parameter | 36.0 | 80.2 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.2 | 11.6 | |