ZHCSN53B December 2019 – March 2021 SN74LXCH8T245
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics
- 6.6 Switching Characteristics, VCCA = 1.2 ± 0.1 V
- 6.7 Switching Characteristics, VCCA = 1.5 ± 0.1 V
- 6.8 Switching Characteristics, VCCA = 1.8 ± 0.15 V
- 6.9 Switching Characteristics, VCCA = 2.5 ± 0.2 V
- 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
- 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
- 6.12 Switching Characteristics: Tsk, TMAX
- 6.13 Operating Characteristics
- 6.14 Typical Characteristics
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
- 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
- 8.3.3 Partial Power Down (Ioff)
- 8.3.4 VCC Isolation and VCC Disconnect
- 8.3.5 Over-Voltage Tolerant Inputs
- 8.3.6 Glitch-Free Power Supply Sequencing
- 8.3.7 Negative Clamping Diodes
- 8.3.8 Fully Configurable Dual-Rail Design
- 8.3.9 Supports High-Speed Translation
- 8.3.10 Bus-Hold Data Inputs
- 8.4 Device Functional Modes
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
11.2 Layout Example
Figure 11-1 Layout Example