SCES538G January 2004 – February 2020 SN74LVC1G38
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74LVC1G38 | UNIT | ||||||
|---|---|---|---|---|---|---|---|---|
| DBV
(SOT-23) |
DCK
(SC70) |
DRY
(SON) |
DSF
(SON) |
YZP
(DSBGA) |
DPW
(X2SON) |
|||
| 5 PINS | 5 PINS | 6 PINS | 6 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 247.2 | 276.1 | 366.9 | 406.2 | 146.2 | 511.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 154.5 | 178.9 | 253.8 | 201.0 | 1.4 | 241.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 86.8 | 70.9 | 227.5 | 256.9 | 39.3 | 374.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 58.0 | 47.0 | 75.8 | 35.2 | 0.7 | 45.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 86.4 | 69.3 | 227.7 | 256.6 | 39.8 | 373.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | 168.0 | °C/W |