ZHCSK63E April 2003 – August 2020 SN74LVC1G125-Q1
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74LVC1G125-Q1 | UNIT | |||
|---|---|---|---|---|---|
| DBV | DCK | DRY | |||
| 5 PINS | 5 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 229 | 278 | 439 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 164 | 93 | 277 | °C/W |
| RθJB | Junction-to-board thermal resistance | 62 | 65 | 271 | °C/W |
| ψJT | Junction-to-top characterization parameter | 44 | 2 | 84 | °C/W |
| ψJB | Junction-to-board characterization parameter | 62 | 64 | 271 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | – | °C/W |