ZHCSJV3G March 2004 – June 2019 SN74LVC1G08-Q1
PRODUCTION DATA.
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74LVC1G08-Q1 | UNIT | |||
|---|---|---|---|---|---|
| DBV | DCK | DRY | |||
| 5 PINS | 5 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 209.4 | 244.2 | 264.4 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 132.5 | 156.1 | 166.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 118.1 | 130.8 | 142.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 48.8 | 47.2 | 26.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 117.4 | 130.0 | 141.6 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | – | – | – | °C/W |