10 Revision History
Changes from Revision AE (June 2025) to Revision AF (October 2025)
- Changed Junction-to-ambient thermal resistance value for DCK package
from: 229°C/W to: 371.0°C/W Go
- Changed Junction-to-case (top) thermal resistance value for DCK
package from: 93°C/W to: 297.5°C/W Go
- Changed Junction-to-board thermal resistance value for DCK package
from: 65°C/W to: 258.6°C/W Go
- Changed Junction-to-top characterization value for DCK package from:
2°C/W to: 195.6°C/W Go
- Changed Junction-to-board characterization value for DCK package
from: 64°C/W to: 256.2°C/W Go
Changes from Revision AD (April 2014) to Revision AE (June 2025)
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Changed Device Information
table to Package
Information
Go
- Moved Tstg to Absolute Maximum
Ratings tableGo
- Changed Handling Ratings to ESD RatingsGo
- Changed Junction-to-ambient thermal resistance value for DBV package
from: 278°C/W to: 357.1°C/W Go
- Changed Junction-to-case (top) thermal resistance value for DBV
package from: 164°C/W to: 263.7°C/W Go
- Changed Junction-to-board thermal resistance value for DBV package
from: 62°C/W to: 264.4°C/W Go
- Changed Junction-to-top characterization value for DBV package from:
44°C/W to: 195.6°C/W Go
- Changed Junction-to-board characterization value for DBV package
from: 62°C/W to: 262.2°C/W Go