ZHCSPK1A July 2022 – December 2022 SN74LV165A-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | SN74LV165A-Q1 | UNIT | |
|---|---|---|---|
WBQB (WQFN) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 86 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 54.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 9.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 54.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 32.5 | °C/W |