ZHCSK22D July 2019 – December 2021 SN74HCS32-Q1
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- BQA|14
訂購信息
5 Pin Configuration and Functions
D, PW or DYY
PackageSOIC, TSSOP or SOT
Top View
BQA Package14-Pin WQFN
Top View
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | Input | Channel 1, Input A |
| 1B | 2 | Input | Channel 1, Input B |
| 1Y | 3 | Output | Channel 1, Output Y |
| 2A | 4 | Input | Channel 2, Input A |
| 2B | 5 | Input | Channel 2, Input B |
| 2Y | 6 | Output | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | Output | Channel 3, Output Y |
| 3A | 9 | Input | Channel 3, Input A |
| 3B | 10 | Input | Channel 3, Input B |
| 4Y | 11 | Output | Channel 4, Output Y |
| 4A | 12 | Input | Channel 4, Input A |
| 4B | 13 | Input | Channel 4, Input B |
| VCC | 14 | — | Positive Supply |
| Thermal Pad(1) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply | |
(1) BQA Package only.