ZHCSK22D July 2019 – December 2021 SN74HCS32-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | SN74HCS32-Q1 | UNIT | ||||
|---|---|---|---|---|---|---|
| PW (TSSOP) | D (SOIC) | BQA (WQFN) | DYY (SOT) | |||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 151.7 | 133.6 | 109.7 | 236.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 79.4 | 89.0 | 111.0 | 143.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 94.7 | 89.5 | 77.9 | 146.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 25.2 | 45.5 | 20.2 | 29.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 94.1 | 89.1 | 77.8 | 145.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 56.6 | N/A | °C/W |