ZHCSIL3A August 2018 – January 2019 SN74AXCH8T245
PRODUCTION DATA.
| THERMAL METRIC(1) | SN74AXCH8T245 | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | RHL (VQFN) | |||
| 24 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 101.7 | 35 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 45.4 | 39.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.9 | 13.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.0 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.4 | 13.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 1.4 | °C/W |