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SCAS416Q March 1994 – September 2016 SN74ALVC164245

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

DGG|48
- MPDS583
DL|48
- MPDS490

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range for V_CCB at 5 V and V_CCA at 3.3 V (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage	V_CCA	–0.5	4.6	V
V_CC	Supply voltage	V_CCB	–0.5	6	V
V_I	Input voltage	Except I/O ports⁽²⁾	–0.5	6	V
		I/O port A⁽³⁾	–0.5	V_CCA + 0.5
		I/O port B⁽²⁾	–0.5	V_CCB + 0.5
I_IK	Input clamp current	V_I < 0		–50	mA
I_OK	Output clamp current	V_O < 0		–50	mA
I_O	Continuous output current			±50	mA
	Continuous current through each V_CC or GND			±100	mA
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) This value is limited to 6 V maximum.

(3) This value is limited to 4.6 V maximum.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions: V_CCB at 3.3 V

for V_CCB at 3.3 V and 5 V⁽¹⁾

			MIN	MAX	UNIT
V_CCB	Supply voltage		3	5.5	V
V_IH	High-level input voltage		2		V
V_IL	Low-level input voltage	V_CCB = 3 V to 3.6 V		0.7	V
V_IL	Low-level input voltage	V_CCB = 4.5 V to 5.5 V		0.8	V
V_IB	Input voltage		0	V_CCB	V
V_OB	Output voltage		0	V_CCB	V
I_OH	High-level output current			–24	mA
I_OL	Low-level output current			24	mA
Δt/Δv	Input transition rise or fall rate			10	ns/V
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. see the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Recommended Operating Conditions: V_CCA at 2.5 V

for V_CCA at 2.5 V and 3.3 V⁽¹⁾

			MIN	MAX	UNIT
V_CCA	Supply voltage		2.3	3.6	V
V_IH	High-level input voltage	V_CCA = 2.3 V to 2.7 V	1.7		V
V_IH	High-level input voltage	V_CCA = 3 V to 3.6 V	2		V
V_IL	Low-level input voltage	V_CCA = 2.3 V to 2.7 V		0.7	V
V_IL	Low-level input voltage	V_CCA = 3 V to 3.6 V		0.8	V
V_IA	Input voltage		0	V_CCA	V
V_OA	Output voltage		0	V_CCA	V
I_OH	High-level output current	V_CCA = 2.3 V		–18	mA
I_OH	High-level output current	V_CCA = 3 V		–24	mA
I_OL	Low-level output current	V_CCA = 2.3 V		18	mA
I_OL	Low-level output current	V_CCA = 3 V		24	mA
Δt/Δv	Input transition rise or fall rate			10	ns/V
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, (SCBA004).

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		SN74ALVC164245				UNIT
		DGG (TSSOP)	DL (SSOP)	ZQL (BGA MICROSTAR JUNIOR)	ZRD (BGA MICROSTAR JUNIOR)
		48 PINS	48 PINS	56 PINS	54 PINS
R_θJA	Junction-to-ambient thermal resistance	60.7	63.6	54.5	50.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	14.3	30.1	19.1	17.9	°C/W
R_θJB	Junction-to-board thermal resistance	27.7	36.2	21.7	20.2	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	8.1	0.5	0.5	°C/W
ψ_JB	Junction-to-board characterization parameter	27.6	35.6	21.7	19.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.6 Electrical Characteristics: V_CCA = 2.7 V to 3.6 V

over recommended operating free-air temperature range for V_CCA = 2.7 V to 3.6 V and V_CCB = 4.5 V to 5.5 V (unless otherwise noted)

PARAMETER		TEST CONDITIONS	V_CCA	V_CCB	MIN	TYP⁽¹⁾	MAX	UNIT
V_OH	B to A	I_OH = –100 µA	2.7 V to 3.6 V		V_CC – 0.2			V
		I_OH = –12 mA	2.7 V		2.2
		I_OH = –12 mA	3 V		2.4
		I_OH = –24 mA	3 V		2
	A to B	I_OH = –100 µA		4.5 V	4.3
		I_OH = –100 µA		5.5 V	5.3
		I_OH = –24 mA		4.5 V	3.7
		I_OH = –24 mA		5.5 V	4.7
V_OL	B to A	I_OL = 100 µA	2.7 V to 3.6 V				0.2	V
		I_OL = 12 mA	2.7 V				0.4
		I_OL = 24 mA	3 V				0.55
	A to B	I_OL = 100 µA		4.5 V to 5.5 V			0.2
	A to B	I_OL = 24 mA		4.5 V to 5.5 V			0.55
I_I	Control inputs	V_I = V_CCA/V_CCB or GND	3.6 V	5.5 V			±5	µA
I_OZ⁽²⁾	A or B port	V_O = V_CCA/V_CCB or GND	3.6 V	5.5 V			±10	µA
I_CC		V_I = V_CCA/V_CCB or GND, I_O = 0	3.6 V	5.5 V			40	µA
ΔI_CC⁽³⁾		One input at V_CCA/V_CCB – 0.6 V, Other inputs at V_CCA/V_CCB or GND	3 V to 3.6 V	4.5 V to 5.5 V			750	µA
C_i	Control inputs	V_I = V_CCA/V_CCB or GND	3.3 V	5 V		6.5		pF
C_i_o	A or B port	V_O = V_CCA/V_CCB or GND	3.3 V	3.3 V		8.5		pF

(1) Typical values are measured at V_CCA = 3.3 V and V_CCB = 5 V, T_A = 25°C.

(2) For I/O ports, the parameter I_OZ includes the input leakage current.

(3) This is the supply current increase for each input that is at one of the specified TTL voltage levels, rather than at 0 or the associated V_CC.

6.7 Electrical Characteristics: V_CCA = 2.3 V to 2.7 V

over recommended operating free-air temperature range for V_CCA = 2.3 V to 2.7 V and V_CCB = 3 V to 3.6 V (unless otherwise noted)

PARAMETER		TEST CONDITIONS	V_CCA	V_CCB	MIN	MAX	UNIT
V_OH	B to A	I_OH = –100 µA	2.3 V to 2.7 V	3 V to 3.6 V	V_CCA – 0.2		V
		I_OH = –8 mA	2.3 V	3 V to 3.6 V	1.7
		I_OH = –12 mA	2.7 V	3 V to 3.6 V	1.8
	A to B	I_OH = –100 µA	2.3 V to 2.7 V	3 V to 3.6 V	V_CCB – 0.2
	A to B	I_OH = –18 mA	2.3 V to 2.7 V	3 V	2.2
V_OL	B to A	I_OL = 100 µA	2.3 V to 2.7 V	3 V to 3.6 V		0.2	V
	B to A	I_OL = 12 mA	2.3 V	3 V to 3.6 V		0.6
	A to B	I_OL = 100 µA	2.3 V to 2.7 V	3 V to 3.6 V		0.2
	A to B	I_OL = 18 mA	2.3 V	3 V		0.55
I_I	Control inputs	V_I = V_CCA/V_CCB or GND	2.3 V to 2.7 V	3 V to 3.6 V		±5	µA
I_OZ⁽¹⁾	A or B port	V_O = V_CCA/V_CCB or GND	2.3 V to 2.7 V	3 V to 3.6 V		±10	µA
I_CC		V_I = V_CCA/V_CCB or GND, I_O = 0	2.3 V to 2.7 V	3 V to 3.6 V		20	µA
ΔI_CC⁽²⁾		One input at V_CCA/V_CCB – 0.6 V, Other inputs at V_CCA/V_CCB or GND	2.3 V to 2.7 V	3 V to 3.6 V		750	µA

(1) For I/O ports, the parameter I_OZ includes the input leakage current.

(2) This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than at 0 or the associated V_CC.

6.8 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2 through Figure 5)

PARAMETER	FROM (INPUT)	TO (OUTPUT)	V_CCB = 3.3 V ± 0.3 V		V_CCB = 5 V ± 0.5 V				UNIT
			V_CCA = 2.5 V ± 0.2 V		V_CCA = 2.7 V		V_CCA = 3.3 V ± 0.3 V
			MIN	MAX	MIN	MAX	MIN	MAX
t_pd	A	B		7.6		5.9	1	5.8	ns
t_pd	B	A		7.6		6.7	1.2	5.8	ns
t_en	OE	B		11.5		9.3	1	8.9	ns
t_dis	OE	B		10.5		9.2	2.1	9.5	ns
t_en	OE	A		12.3		10.2	2	9.1	ns
t_dis	OE	A		9.3		9	2.9	8.6	ns

6.9 Operating Characteristics

T_A = 25°C

PARAMETER			TEST CONDITIONS	V_CCB = 3.3 V	V_CCB = 5 V	UNIT
				V_CCA = 2.5 V	V_CCA = 3.3 V
				TYP	TYP
C_pd	Power dissipation capacitance	Outputs enabled (B)	C_L = 50 pF, f = 10 MHz	55	56	pF
		Outputs disabled (B)	C_L = 50 pF, f = 10 MHz	27	6
		Outputs enabled (A)	C_L = 50 pF, f = 10 MHz	118	56
		Outputs disabled (A)	C_L = 50 pF, f = 10 MHz	58	6

6.10 Typical Characteristics

Figure 1. V_OH vs I_OH